METHOD OF MANUFACTURING SQUARE-SHAPED BOARD

PROBLEM TO BE SOLVED: To remove cracks caused by the unevenness at the flank or the inequality in thickness of a square-shaped board, when manufacturing the square-shaped board by slicing a square-shaped ingot. SOLUTION: The square-shaped ingot A is transferred to an upward support 8a on the truck 8...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TOYODA YOSHIHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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