PLATING APPARATUS

PROBLEM TO BE SOLVED: To provide a plating apparatus by which plating of high throwing power can be performed, and further, plating time can be reduced. SOLUTION: The plating apparatus has an anode plate 7, and the body 1 to be plated as the cathode having a fine-sized hole at a prescribed position; where they are arranged so as to be confronted at prescribed intervals in a plating solution 6. The apparatus has rolling means eccentrically provided with two rolling elements 4 on both sides of a supporting member 3 suspending and supporting the body 1 to be plated. The apparatus has a bubble generating means 8 generating lots of bubbles 10 rising from the lower direction of the body 1 to be plated along the upper direction in the plating solution 6. The two rolling elements 4 are synchronously rotated, so that the body 1 to be plated is circularly or elliptically shaked in the plane. Further, while forming a rising flow of the bubbles 10 from the lower direction of the body 1 to be plated along the upper direction, plating is applied to the surface including the inside face of the hole of the body 1 to be plated. In this plating apparatus, the shaking amplitude in the plating solution 6 of the body 1 to be plated is controlled to the range of 2 to 10 mm.