COOLING DEVICE AND SUBSTRATE PROCESSING DEVICE
PROBLEM TO BE SOLVED: To provide a cooling device which is capable of keeping a substrate high in temperature uniformity, while subjecting the substrate to cooling and improving the throughput. SOLUTION: A substrate W as a work is placed on a mounting plate 31. A Peltier module 40 is laminated under...
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| creator | TSUJI MASAO HATANAKA YASUO SASADA SHIGERU HAMAZAKI MASARU |
| description | PROBLEM TO BE SOLVED: To provide a cooling device which is capable of keeping a substrate high in temperature uniformity, while subjecting the substrate to cooling and improving the throughput. SOLUTION: A substrate W as a work is placed on a mounting plate 31. A Peltier module 40 is laminated under the mounting plate 31 through the intermediary of a silicone grease film 32 of high thermal conductivity, and a cooling plate 34 is laminated under the Peltier module 40 through the intermediary of a silicone grease film 33. Electrical energy supplied to the Peltier module 40 is adjusted by a power supply/control unit 37, on the basis of the measurement result of a temperature sensor 38 embedded in the mounting plate 31. Since the Peltier module 40 has the same planar shape as that of the mounting plate 31, and Peltier elements are arranged in the module 40 to be uniform in number per unit area in a plan view, the mounting plate 31 can be kept uniform in temperature distribution, even if it is reduced in thickness, the substrate W can be kept high in temperature uniformity, when it undergoes a cooling, and this cooling device can obtain high throughput. |
| format | Patent |
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SOLUTION: A substrate W as a work is placed on a mounting plate 31. A Peltier module 40 is laminated under the mounting plate 31 through the intermediary of a silicone grease film 32 of high thermal conductivity, and a cooling plate 34 is laminated under the Peltier module 40 through the intermediary of a silicone grease film 33. Electrical energy supplied to the Peltier module 40 is adjusted by a power supply/control unit 37, on the basis of the measurement result of a temperature sensor 38 embedded in the mounting plate 31. Since the Peltier module 40 has the same planar shape as that of the mounting plate 31, and Peltier elements are arranged in the module 40 to be uniform in number per unit area in a plan view, the mounting plate 31 can be kept uniform in temperature distribution, even if it is reduced in thickness, the substrate W can be kept high in temperature uniformity, when it undergoes a cooling, and this cooling device can obtain high throughput.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; COLD ROOMS ; COMBINED HEATING AND REFRIGERATION SYSTEMS ; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT PUMP SYSTEMS ; HEATING ; ICE-BOXES ; LIGHTING ; LIQUEFACTION SOLIDIFICATION OF GASES ; MANUFACTURE OR STORAGE OF ICE ; MECHANICAL ENGINEERING ; REFRIGERATION OR COOLING ; REFRIGERATORS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020816&DB=EPODOC&CC=JP&NR=2002231623A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020816&DB=EPODOC&CC=JP&NR=2002231623A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUJI MASAO</creatorcontrib><creatorcontrib>HATANAKA YASUO</creatorcontrib><creatorcontrib>SASADA SHIGERU</creatorcontrib><creatorcontrib>HAMAZAKI MASARU</creatorcontrib><title>COOLING DEVICE AND SUBSTRATE PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a cooling device which is capable of keeping a substrate high in temperature uniformity, while subjecting the substrate to cooling and improving the throughput. 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Since the Peltier module 40 has the same planar shape as that of the mounting plate 31, and Peltier elements are arranged in the module 40 to be uniform in number per unit area in a plan view, the mounting plate 31 can be kept uniform in temperature distribution, even if it is reduced in thickness, the substrate W can be kept high in temperature uniformity, when it undergoes a cooling, and this cooling device can obtain high throughput.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>COLD ROOMS</subject><subject>COMBINED HEATING AND REFRIGERATION SYSTEMS</subject><subject>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT PUMP SYSTEMS</subject><subject>HEATING</subject><subject>ICE-BOXES</subject><subject>LIGHTING</subject><subject>LIQUEFACTION SOLIDIFICATION OF GASES</subject><subject>MANUFACTURE OR STORAGE OF ICE</subject><subject>MECHANICAL ENGINEERING</subject><subject>REFRIGERATION OR COOLING</subject><subject>REFRIGERATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBz9vf38fRzV3BxDfN0dlVw9HNRCA51Cg4JcgxxVQgI8nd2DQ5GyPMwsKYl5hSn8kJpbgYlN9cQZw_d1IL8-NTigsTk1LzUknivACMDAyMjY0MzI2NHY6IUAQAkXSYL</recordid><startdate>20020816</startdate><enddate>20020816</enddate><creator>TSUJI MASAO</creator><creator>HATANAKA YASUO</creator><creator>SASADA SHIGERU</creator><creator>HAMAZAKI MASARU</creator><scope>EVB</scope></search><sort><creationdate>20020816</creationdate><title>COOLING DEVICE AND SUBSTRATE PROCESSING DEVICE</title><author>TSUJI MASAO ; HATANAKA YASUO ; SASADA SHIGERU ; HAMAZAKI MASARU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002231623A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>COLD ROOMS</topic><topic>COMBINED HEATING AND REFRIGERATION SYSTEMS</topic><topic>COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT PUMP SYSTEMS</topic><topic>HEATING</topic><topic>ICE-BOXES</topic><topic>LIGHTING</topic><topic>LIQUEFACTION SOLIDIFICATION OF GASES</topic><topic>MANUFACTURE OR STORAGE OF ICE</topic><topic>MECHANICAL ENGINEERING</topic><topic>REFRIGERATION OR COOLING</topic><topic>REFRIGERATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUJI MASAO</creatorcontrib><creatorcontrib>HATANAKA YASUO</creatorcontrib><creatorcontrib>SASADA SHIGERU</creatorcontrib><creatorcontrib>HAMAZAKI MASARU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUJI MASAO</au><au>HATANAKA YASUO</au><au>SASADA SHIGERU</au><au>HAMAZAKI MASARU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING DEVICE AND SUBSTRATE PROCESSING DEVICE</title><date>2002-08-16</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a cooling device which is capable of keeping a substrate high in temperature uniformity, while subjecting the substrate to cooling and improving the throughput. SOLUTION: A substrate W as a work is placed on a mounting plate 31. A Peltier module 40 is laminated under the mounting plate 31 through the intermediary of a silicone grease film 32 of high thermal conductivity, and a cooling plate 34 is laminated under the Peltier module 40 through the intermediary of a silicone grease film 33. Electrical energy supplied to the Peltier module 40 is adjusted by a power supply/control unit 37, on the basis of the measurement result of a temperature sensor 38 embedded in the mounting plate 31. Since the Peltier module 40 has the same planar shape as that of the mounting plate 31, and Peltier elements are arranged in the module 40 to be uniform in number per unit area in a plan view, the mounting plate 31 can be kept uniform in temperature distribution, even if it is reduced in thickness, the substrate W can be kept high in temperature uniformity, when it undergoes a cooling, and this cooling device can obtain high throughput.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES WEAPONS |
| title | COOLING DEVICE AND SUBSTRATE PROCESSING DEVICE |
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