METHOD AND SYSTEM FOR SUBSTRATE TREATMENT

PROBLEM TO BE SOLVED: To reduce influence on rate limiting due to other treatment parts. SOLUTION: The system consists of a load/unload part 2 which carries an untreated wafer into each treatment unit and unloads a treated wafer W from each of the treatment units, a sub-arm mechanism which is provid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TATEYAMA MASANORI, MIYATA AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PACKING PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES STORING TRANSPORTING
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