METHOD AND SYSTEM FOR SUBSTRATE TREATMENT

PROBLEM TO BE SOLVED: To reduce influence on rate limiting due to other treatment parts. SOLUTION: The system consists of a load/unload part 2 which carries an untreated wafer into each treatment unit and unloads a treated wafer W from each of the treatment units, a sub-arm mechanism which is provid...

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Bibliographische Detailangaben
Hauptverfasser:	TATEYAMA MASANORI, MIYATA AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PACKING PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To reduce influence on rate limiting due to other treatment parts. SOLUTION: The system consists of a load/unload part 2 which carries an untreated wafer into each treatment unit and unloads a treated wafer W from each of the treatment units, a sub-arm mechanism which is provided to each treatment unit accessibly, delivers a wafer W between it and the load/unload part 2 and carries a wafer W to each treatment unit one by one and a controller 13, which controls each part to carry out treatment by each treatment unit one by one by applying a maximum duration tn/m per unit, which is obtained by dividing the duration tn of each treatment unit by a number (m) of the treatment units as a single cycle, and sets a prewaiting time by a heat treatment system unit.