CERAMIC COMPOSITION BAKED AT LOW TEMPERATURE AND MULTI- LAYER WIRING BOARD USING IT
PROBLEM TO BE SOLVED: To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric c...
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| creator | KIMURA TETSUYA NAGAE KENICHI NAKAO YOSHIHIRO KOKUBU MASAYA SUZUKI SHINICHI |
| description | PROBLEM TO BE SOLVED: To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric constant by temperature change, and provide multi-layer wiring board using it for a part of insulating substrate. SOLUTION: The low temperature sintered ceramic composition containing SiO2 of 10-30 wt.%, MgO of 1-10 wt.%, CaO of 5-15 wt.%, TiO2 of 15-30 wt.% and La2O3 of 5-25 wt.%, with the specific dielectric constant of >=14 at 1 MHz-3 GHz, dielectric loss of |
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SOLUTION: The low temperature sintered ceramic composition containing SiO2 of 10-30 wt.%, MgO of 1-10 wt.%, CaO of 5-15 wt.%, TiO2 of 15-30 wt.% and La2O3 of 5-25 wt.%, with the specific dielectric constant of >=14 at 1 MHz-3 GHz, dielectric loss of <=50×10-4, the absolute value of the changing ratio of the dielectric constant by the temperature change of <=100×10-6/ deg.C at -40-85 deg.C, and is used for inside insulating layer 1b of the multi-layer wiring board. On both the upper/lower faces of the insulator layer 1b the electrodes 3, 3 are formed and provides a built in capacitor in the multi-layer wiring board.</description><edition>7</edition><language>eng</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; LIME, MAGNESIA ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; REFRACTORIES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SLAG ; TREATMENT OF NATURAL STONE</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020611&DB=EPODOC&CC=JP&NR=2002167274A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020611&DB=EPODOC&CC=JP&NR=2002167274A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIMURA TETSUYA</creatorcontrib><creatorcontrib>NAGAE KENICHI</creatorcontrib><creatorcontrib>NAKAO YOSHIHIRO</creatorcontrib><creatorcontrib>KOKUBU MASAYA</creatorcontrib><creatorcontrib>SUZUKI SHINICHI</creatorcontrib><title>CERAMIC COMPOSITION BAKED AT LOW TEMPERATURE AND MULTI- LAYER WIRING BOARD USING IT</title><description>PROBLEM TO BE SOLVED: To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric constant by temperature change, and provide multi-layer wiring board using it for a part of insulating substrate. SOLUTION: The low temperature sintered ceramic composition containing SiO2 of 10-30 wt.%, MgO of 1-10 wt.%, CaO of 5-15 wt.%, TiO2 of 15-30 wt.% and La2O3 of 5-25 wt.%, with the specific dielectric constant of >=14 at 1 MHz-3 GHz, dielectric loss of <=50×10-4, the absolute value of the changing ratio of the dielectric constant by the temperature change of <=100×10-6/ deg.C at -40-85 deg.C, and is used for inside insulating layer 1b of the multi-layer wiring board. On both the upper/lower faces of the insulator layer 1b the electrodes 3, 3 are formed and provides a built in capacitor in the multi-layer wiring board.</description><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LIME, MAGNESIA</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>REFRACTORIES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SLAG</subject><subject>TREATMENT OF NATURAL STONE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyj0KwkAQQOFtLES9w5A-EFcx9WSz6uj-sZkQrEKQtRINxPujggeweq_45qJROqIlBcrb4Bti8g4qPOsakMH4Dljb8DHcRg3oarCtYcrB4EVH6CiSO0DlMdbQNt8nXorZbbhPafXrQmR7zeqYp_HZp2kcrumRXv0pyKKQ610pyy1u_kJvPFkwAw</recordid><startdate>20020611</startdate><enddate>20020611</enddate><creator>KIMURA TETSUYA</creator><creator>NAGAE KENICHI</creator><creator>NAKAO YOSHIHIRO</creator><creator>KOKUBU MASAYA</creator><creator>SUZUKI SHINICHI</creator><scope>EVB</scope></search><sort><creationdate>20020611</creationdate><title>CERAMIC COMPOSITION BAKED AT LOW TEMPERATURE AND MULTI- LAYER WIRING BOARD USING IT</title><author>KIMURA TETSUYA ; NAGAE KENICHI ; NAKAO YOSHIHIRO ; KOKUBU MASAYA ; SUZUKI SHINICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002167274A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LIME, MAGNESIA</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>REFRACTORIES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SLAG</topic><topic>TREATMENT OF NATURAL STONE</topic><toplevel>online_resources</toplevel><creatorcontrib>KIMURA TETSUYA</creatorcontrib><creatorcontrib>NAGAE KENICHI</creatorcontrib><creatorcontrib>NAKAO YOSHIHIRO</creatorcontrib><creatorcontrib>KOKUBU MASAYA</creatorcontrib><creatorcontrib>SUZUKI SHINICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIMURA TETSUYA</au><au>NAGAE KENICHI</au><au>NAKAO YOSHIHIRO</au><au>KOKUBU MASAYA</au><au>SUZUKI SHINICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CERAMIC COMPOSITION BAKED AT LOW TEMPERATURE AND MULTI- LAYER WIRING BOARD USING IT</title><date>2002-06-11</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric constant by temperature change, and provide multi-layer wiring board using it for a part of insulating substrate. SOLUTION: The low temperature sintered ceramic composition containing SiO2 of 10-30 wt.%, MgO of 1-10 wt.%, CaO of 5-15 wt.%, TiO2 of 15-30 wt.% and La2O3 of 5-25 wt.%, with the specific dielectric constant of >=14 at 1 MHz-3 GHz, dielectric loss of <=50×10-4, the absolute value of the changing ratio of the dielectric constant by the temperature change of <=100×10-6/ deg.C at -40-85 deg.C, and is used for inside insulating layer 1b of the multi-layer wiring board. On both the upper/lower faces of the insulator layer 1b the electrodes 3, 3 are formed and provides a built in capacitor in the multi-layer wiring board.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SLAG TREATMENT OF NATURAL STONE |
| title | CERAMIC COMPOSITION BAKED AT LOW TEMPERATURE AND MULTI- LAYER WIRING BOARD USING IT |
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