CERAMIC COMPOSITION BAKED AT LOW TEMPERATURE AND MULTI- LAYER WIRING BOARD USING IT

PROBLEM TO BE SOLVED: To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric c...

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Bibliographische Detailangaben
Hauptverfasser:	KIMURA TETSUYA, NAGAE KENICHI, NAKAO YOSHIHIRO, KOKUBU MASAYA, SUZUKI SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a ceramic composition baked at a low temperature capable of baking coincidently with a low resistant conductor such as copper or silver, with a high specific dielectric constant, low tan δ, and a small absolute value of the changing ratio of the specific dielectric constant by temperature change, and provide multi-layer wiring board using it for a part of insulating substrate. SOLUTION: The low temperature sintered ceramic composition containing SiO2 of 10-30 wt.%, MgO of 1-10 wt.%, CaO of 5-15 wt.%, TiO2 of 15-30 wt.% and La2O3 of 5-25 wt.%, with the specific dielectric constant of >=14 at 1 MHz-3 GHz, dielectric loss of