METHOD AND DEVICE FOR ALIGNMENT
PROBLEM TO BE SOLVED: To provide a method and a device for alignment capable of easily and absolutely adjusting the relative position between both the objects to be joined within acceptable accuracy in the case that alignment is performed for joining the objects to be joined and that one object is c...
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| creator | YAMAUCHI AKIRA UENISHI TAKASHI |
| description | PROBLEM TO BE SOLVED: To provide a method and a device for alignment capable of easily and absolutely adjusting the relative position between both the objects to be joined within acceptable accuracy in the case that alignment is performed for joining the objects to be joined and that one object is covered with a coating material. SOLUTION: When the relative position between the first object to be joined and the second object to be joined covered with a coating material is aligned, the reference mark that is the representative of position of aligning the first object to be joined at the position corresponding to the area of outside covering material of the second object to be joined is displayed on a screen on the basis of the position of a mark for aligning the first object to be joined recognized by means of recognition, and the position of the mark for aligning the second object to be joined fitted on the outside of the coating material of the second object to be joined which is recognized by the recognition means is displayed on the screen. This is the feature of this method and device for alignment that the position of the second object to be joined is corrected so that the position of the mark for aligning the second object to be joined can falls in the given acceptable accuracy to the position of the reference mark. |
| format | Patent |
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SOLUTION: When the relative position between the first object to be joined and the second object to be joined covered with a coating material is aligned, the reference mark that is the representative of position of aligning the first object to be joined at the position corresponding to the area of outside covering material of the second object to be joined is displayed on a screen on the basis of the position of a mark for aligning the first object to be joined recognized by means of recognition, and the position of the mark for aligning the second object to be joined fitted on the outside of the coating material of the second object to be joined which is recognized by the recognition means is displayed on the screen. This is the feature of this method and device for alignment that the position of the second object to be joined is corrected so that the position of the mark for aligning the second object to be joined can falls in the given acceptable accuracy to the position of the reference mark.</description><edition>7</edition><language>eng</language><subject>ACCESSORIES THEREFOR ; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES ; APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; INSTRUMENT DETAILS ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHOTOGRAPHY ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020607&DB=EPODOC&CC=JP&NR=2002162206A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020607&DB=EPODOC&CC=JP&NR=2002162206A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAUCHI AKIRA</creatorcontrib><creatorcontrib>UENISHI TAKASHI</creatorcontrib><title>METHOD AND DEVICE FOR ALIGNMENT</title><description>PROBLEM TO BE SOLVED: To provide a method and a device for alignment capable of easily and absolutely adjusting the relative position between both the objects to be joined within acceptable accuracy in the case that alignment is performed for joining the objects to be joined and that one object is covered with a coating material. SOLUTION: When the relative position between the first object to be joined and the second object to be joined covered with a coating material is aligned, the reference mark that is the representative of position of aligning the first object to be joined at the position corresponding to the area of outside covering material of the second object to be joined is displayed on a screen on the basis of the position of a mark for aligning the first object to be joined recognized by means of recognition, and the position of the mark for aligning the second object to be joined fitted on the outside of the coating material of the second object to be joined which is recognized by the recognition means is displayed on the screen. This is the feature of this method and device for alignment that the position of the second object to be joined is corrected so that the position of the mark for aligning the second object to be joined can falls in the given acceptable accuracy to the position of the reference mark.</description><subject>ACCESSORIES THEREFOR</subject><subject>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</subject><subject>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>INSTRUMENT DETAILS</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD3dQ3x8HdRcPRzUXBxDfN0dlVw8w9ScPTxdPfzdfUL4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGRoZmRkYGZo7GRCkCAPKQIa4</recordid><startdate>20020607</startdate><enddate>20020607</enddate><creator>YAMAUCHI AKIRA</creator><creator>UENISHI TAKASHI</creator><scope>EVB</scope></search><sort><creationdate>20020607</creationdate><title>METHOD AND DEVICE FOR ALIGNMENT</title><author>YAMAUCHI AKIRA ; UENISHI TAKASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002162206A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>ACCESSORIES THEREFOR</topic><topic>APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES</topic><topic>APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>INSTRUMENT DETAILS</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAUCHI AKIRA</creatorcontrib><creatorcontrib>UENISHI TAKASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAUCHI AKIRA</au><au>UENISHI TAKASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND DEVICE FOR ALIGNMENT</title><date>2002-06-07</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method and a device for alignment capable of easily and absolutely adjusting the relative position between both the objects to be joined within acceptable accuracy in the case that alignment is performed for joining the objects to be joined and that one object is covered with a coating material. SOLUTION: When the relative position between the first object to be joined and the second object to be joined covered with a coating material is aligned, the reference mark that is the representative of position of aligning the first object to be joined at the position corresponding to the area of outside covering material of the second object to be joined is displayed on a screen on the basis of the position of a mark for aligning the first object to be joined recognized by means of recognition, and the position of the mark for aligning the second object to be joined fitted on the outside of the coating material of the second object to be joined which is recognized by the recognition means is displayed on the screen. This is the feature of this method and device for alignment that the position of the second object to be joined is corrected so that the position of the mark for aligning the second object to be joined can falls in the given acceptable accuracy to the position of the reference mark.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INSTRUMENT DETAILS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHOTOGRAPHY PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | METHOD AND DEVICE FOR ALIGNMENT |
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