CMP MACHINING DRESSER

PROBLEM TO BE SOLVED: To improve the retaining force and chemical resistance of abrasive grains in a CMP machining dresser while maintaining the cutting quality equal or higher than that of the conventional dresser. SOLUTION: A coating layer mainly made of borosilicate glass and having the thickness...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOGE NAOKI, NONOSHITA TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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