CMP MACHINING DRESSER

PROBLEM TO BE SOLVED: To improve the retaining force and chemical resistance of abrasive grains in a CMP machining dresser while maintaining the cutting quality equal or higher than that of the conventional dresser. SOLUTION: A coating layer mainly made of borosilicate glass and having the thickness...

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Bibliographische Detailangaben
Hauptverfasser:	TOGE NAOKI, NONOSHITA TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the retaining force and chemical resistance of abrasive grains in a CMP machining dresser while maintaining the cutting quality equal or higher than that of the conventional dresser. SOLUTION: A coating layer mainly made of borosilicate glass and having the thickness of 1/2 or below of the grain size of the abrasive grains is applied to the surface of the brazing filler metal layer of the dresser, with the abrasive grains fixed to the surface of a base material by brazing, thereby the brazing filler metal layer and the metal of the base material are prevented from being eroded by abrasives even when the strong acidic or strong alkaline abrasives are used in CMP machining, thus preventing the elution of metal and the drop of the abrasives.