FLAME RETARDANT RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain a flame retardant resin composition suitable for an electrical insulating material, a solder resist material, an encapsulant, on the like., used in an electronic circuit base board or an electronic part, without containing a halogen compound, having excellent heat res...

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description PROBLEM TO BE SOLVED: To obtain a flame retardant resin composition suitable for an electrical insulating material, a solder resist material, an encapsulant, on the like., used in an electronic circuit base board or an electronic part, without containing a halogen compound, having excellent heat resistance and scarcely causing hydrolysis with slight bleeding of a phosphorus component. SOLUTION: This flame retardant resin composition comprises (A) a compound prepared by reacting a compound having at least >=2 acrylic groups and/or methacrylic groups in the molecule with a compound having at least one active hydrogen directly bound to phosphorus atom within the range of 0.1-0.7 equivalent based on 1 equivalent of the acrylic groups and/or methacrylic groups in the molecule and (B) a phtopolymerization or a thermal polymerization initiator. The content of the phosphorus in the flame retardant resin composition is 0.5-10 wt.%.
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SOLUTION: This flame retardant resin composition comprises (A) a compound prepared by reacting a compound having at least &gt;=2 acrylic groups and/or methacrylic groups in the molecule with a compound having at least one active hydrogen directly bound to phosphorus atom within the range of 0.1-0.7 equivalent based on 1 equivalent of the acrylic groups and/or methacrylic groups in the molecule and (B) a phtopolymerization or a thermal polymerization initiator. 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SOLUTION: This flame retardant resin composition comprises (A) a compound prepared by reacting a compound having at least &gt;=2 acrylic groups and/or methacrylic groups in the molecule with a compound having at least one active hydrogen directly bound to phosphorus atom within the range of 0.1-0.7 equivalent based on 1 equivalent of the acrylic groups and/or methacrylic groups in the molecule and (B) a phtopolymerization or a thermal polymerization initiator. 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SOLUTION: This flame retardant resin composition comprises (A) a compound prepared by reacting a compound having at least &gt;=2 acrylic groups and/or methacrylic groups in the molecule with a compound having at least one active hydrogen directly bound to phosphorus atom within the range of 0.1-0.7 equivalent based on 1 equivalent of the acrylic groups and/or methacrylic groups in the molecule and (B) a phtopolymerization or a thermal polymerization initiator. The content of the phosphorus in the flame retardant resin composition is 0.5-10 wt.%.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
CONDUCTORS
ELECTRICITY
INSULATORS
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
title FLAME RETARDANT RESIN COMPOSITION
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