FLAME RETARDANT RESIN COMPOSITION

PROBLEM TO BE SOLVED: To obtain a flame retardant resin composition suitable for an electrical insulating material, a solder resist material, an encapsulant, on the like., used in an electronic circuit base board or an electronic part, without containing a halogen compound, having excellent heat res...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	NISHIGUCHI SHOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a flame retardant resin composition suitable for an electrical insulating material, a solder resist material, an encapsulant, on the like., used in an electronic circuit base board or an electronic part, without containing a halogen compound, having excellent heat resistance and scarcely causing hydrolysis with slight bleeding of a phosphorus component. SOLUTION: This flame retardant resin composition comprises (A) a compound prepared by reacting a compound having at least >=2 acrylic groups and/or methacrylic groups in the molecule with a compound having at least one active hydrogen directly bound to phosphorus atom within the range of 0.1-0.7 equivalent based on 1 equivalent of the acrylic groups and/or methacrylic groups in the molecule and (B) a phtopolymerization or a thermal polymerization initiator. The content of the phosphorus in the flame retardant resin composition is 0.5-10 wt.%.