MICROELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method capable of etching a contact hole, after coating an effective hydrogen barrier using a simple method, and to provide a microelectronic constituent member. SOLUTION: A method for manufacturing the microelectronic constituent member comprises the steps of form...

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Hauptverfasser: SCHINDLER GUENTHER DR, HARTNER WALTER, GABRIC ZVONIMIR
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SCHINDLER GUENTHER DR
HARTNER WALTER
GABRIC ZVONIMIR
description PROBLEM TO BE SOLVED: To provide a method capable of etching a contact hole, after coating an effective hydrogen barrier using a simple method, and to provide a microelectronic constituent member. SOLUTION: A method for manufacturing the microelectronic constituent member comprises the steps of forming a memory capacitor (3) containing a first electrode (31), a second electrode (32) and a ferroelectric or paraelectric dielectric (33) between the electrodes (31, 32) on a substrate (1); first, forming a silicon oxide (41) in the case of forming a barrier (4) to form the barrier (4) for protecting against infiltration of hydrogen onto the capacitor (3); annealing at least a part of the capacitor (3) and the silicon oxide (41); and coating the barrier layer (42) for protecting against the infiltration of hydrogen on the annealed silicon oxide layer (41). The microelectronic constituent member manufactured by the method is provided.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MICROELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
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