METHOD FOR RECOGNIZING ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide a method for recognizing an electronic component, in which positional displacement of a connection terminal can be recognized easily in the height direction. SOLUTION: In the method for recognizing an electronic component, depth of field S of a focus lens 12 is deter...
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| creator | OE HARUKI |
| description | PROBLEM TO BE SOLVED: To provide a method for recognizing an electronic component, in which positional displacement of a connection terminal can be recognized easily in the height direction. SOLUTION: In the method for recognizing an electronic component, depth of field S of a focus lens 12 is determined, with reference to the coating thickness H at a soldered part 21 which is applied to a circuit board 20. When an electronic component A and an image sensor 9 are moved in the height direction P of a connection terminal 4, to approach each other or recede from each other, the image of the connection terminal 4 picked up by means of the image sensor 9 is obtained with a prescribed resolution in the height direction P. When, for example, the images of all connection terminals 4 at the connecting parts appear with the same timing in the substantially same state, a decision can be made that all connection terminals 4 are in proper states in the height direction. When a trouble occurs in the height direction at prescribed connection terminals 4A, 4B, only these connection terminals 4A, 4B at the connecting parts are imaged with a timing which is ahead of or lags in time behind the images of other properly connected terminals 4 at the connecting parts. |
| format | Patent |
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SOLUTION: In the method for recognizing an electronic component, depth of field S of a focus lens 12 is determined, with reference to the coating thickness H at a soldered part 21 which is applied to a circuit board 20. When an electronic component A and an image sensor 9 are moved in the height direction P of a connection terminal 4, to approach each other or recede from each other, the image of the connection terminal 4 picked up by means of the image sensor 9 is obtained with a prescribed resolution in the height direction P. When, for example, the images of all connection terminals 4 at the connecting parts appear with the same timing in the substantially same state, a decision can be made that all connection terminals 4 are in proper states in the height direction. 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SOLUTION: In the method for recognizing an electronic component, depth of field S of a focus lens 12 is determined, with reference to the coating thickness H at a soldered part 21 which is applied to a circuit board 20. When an electronic component A and an image sensor 9 are moved in the height direction P of a connection terminal 4, to approach each other or recede from each other, the image of the connection terminal 4 picked up by means of the image sensor 9 is obtained with a prescribed resolution in the height direction P. When, for example, the images of all connection terminals 4 at the connecting parts appear with the same timing in the substantially same state, a decision can be made that all connection terminals 4 are in proper states in the height direction. When a trouble occurs in the height direction at prescribed connection terminals 4A, 4B, only these connection terminals 4A, 4B at the connecting parts are imaged with a timing which is ahead of or lags in time behind the images of other properly connected terminals 4 at the connecting parts.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS TESTING |
| title | METHOD FOR RECOGNIZING ELECTRONIC COMPONENT |
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