DEVICE AND METHOD FOR STRIPPING FILM

DEVICE AND METHOD FOR STRIPPING FILM

PROBLEM TO BE SOLVED: To provide a method and device for stripping an individual film piece bonded on a mount board surface reliably with a high yield. SOLUTION: This device has a board holding table for fixing a mount board with one or a plurality of individual film pieces bonded on the surface the...

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1. Verfasser: GUNJI AKIHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator GUNJI AKIHIRO
description PROBLEM TO BE SOLVED: To provide a method and device for stripping an individual film piece bonded on a mount board surface reliably with a high yield. SOLUTION: This device has a board holding table for fixing a mount board with one or a plurality of individual film pieces bonded on the surface thereof; and a stripping head mechanism having a guide mechanism of an adhesive tape, and a head portion which presses the individual film piece onto an adhesive surface of the adhesive tape and pulls the piece back. In this stripping head mechanism, the individual film piece is bonded to a stripping tape having an adhesive surface on one side thereof to make a start of stripping, and the film is stripped along with the stripping tape when they are pulled back.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2002043339A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2002043339A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2002043339A3</originalsourceid><addsrcrecordid>eNrjZFBxcQ3zdHZVcPRzUfB1DfHwd1Fw8w9SCA4J8gwI8PRzV3Dz9PHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgZGBibGxsaWjsZEKQIAo7QjJg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEVICE AND METHOD FOR STRIPPING FILM</title><source>esp@cenet</source><creator>GUNJI AKIHIRO</creator><creatorcontrib>GUNJI AKIHIRO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a method and device for stripping an individual film piece bonded on a mount board surface reliably with a high yield. SOLUTION: This device has a board holding table for fixing a mount board with one or a plurality of individual film pieces bonded on the surface thereof; and a stripping head mechanism having a guide mechanism of an adhesive tape, and a head portion which presses the individual film piece onto an adhesive surface of the adhesive tape and pulls the piece back. In this stripping head mechanism, the individual film piece is bonded to a stripping tape having an adhesive surface on one side thereof to make a start of stripping, and the film is stripped along with the stripping tape when they are pulled back.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020208&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002043339A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020208&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002043339A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUNJI AKIHIRO</creatorcontrib><title>DEVICE AND METHOD FOR STRIPPING FILM</title><description>PROBLEM TO BE SOLVED: To provide a method and device for stripping an individual film piece bonded on a mount board surface reliably with a high yield. SOLUTION: This device has a board holding table for fixing a mount board with one or a plurality of individual film pieces bonded on the surface thereof; and a stripping head mechanism having a guide mechanism of an adhesive tape, and a head portion which presses the individual film piece onto an adhesive surface of the adhesive tape and pulls the piece back. In this stripping head mechanism, the individual film piece is bonded to a stripping tape having an adhesive surface on one side thereof to make a start of stripping, and the film is stripped along with the stripping tape when they are pulled back.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBxcQ3zdHZVcPRzUfB1DfHwd1Fw8w9SCA4J8gwI8PRzV3Dz9PHlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgZGBibGxsaWjsZEKQIAo7QjJg</recordid><startdate>20020208</startdate><enddate>20020208</enddate><creator>GUNJI AKIHIRO</creator><scope>EVB</scope></search><sort><creationdate>20020208</creationdate><title>DEVICE AND METHOD FOR STRIPPING FILM</title><author>GUNJI AKIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002043339A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GUNJI AKIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUNJI AKIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE AND METHOD FOR STRIPPING FILM</title><date>2002-02-08</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method and device for stripping an individual film piece bonded on a mount board surface reliably with a high yield. SOLUTION: This device has a board holding table for fixing a mount board with one or a plurality of individual film pieces bonded on the surface thereof; and a stripping head mechanism having a guide mechanism of an adhesive tape, and a head portion which presses the individual film piece onto an adhesive surface of the adhesive tape and pulls the piece back. In this stripping head mechanism, the individual film piece is bonded to a stripping tape having an adhesive surface on one side thereof to make a start of stripping, and the film is stripped along with the stripping tape when they are pulled back.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DEVICE AND METHOD FOR STRIPPING FILM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T02%3A32%3A02IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GUNJI%20AKIHIRO&rft.date=2002-02-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2002043339A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true