BGA SEMICONDUCTOR DEVICE

BGA SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a BGA semiconductor device which is free of missing of solder balls. SOLUTION: This BGA type semiconductor device has a projection terminal (a) of an electrically conductive element formed at a terminal position of the substrate 1 integrally with the substrate 1, and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NISHIMOTO KAZUHIKO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a BGA semiconductor device which is free of missing of solder balls. SOLUTION: This BGA type semiconductor device has a projection terminal (a) of an electrically conductive element formed at a terminal position of the substrate 1 integrally with the substrate 1, and a semiconductor chip 2 and the projection terminal (a) are bonded and molded with sealing resin.