METHOD AND DEVICE FOR POLISHING SUBSTRATE, AND METHOD AND DEVICE FOR MEASURNG FILM THICKNESS

PROBLEM TO BE SOLVED: To maintain accuracy in film thickness measurement even in the continuous state of polishing. SOLUTION: A film thickness measuring means 8 is provided for measuring the film thickness of a substrate S while continuing or interrupting polishing, and a control means 11 is provide...

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Bibliographische Detailangaben
Hauptverfasser:	BAN MINOKICHI, CHICHII MASARU, SUZUKI TAKEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PERFORMING OPERATIONS PHYSICS POLISHING SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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