MEMORY CARD
PROBLEM TO BE SOLVED: To provide a memory card which can be made small-sized and thin and held strong on the whole. SOLUTION: This memory card has a semiconductor memory which can have its recording contents rewritten and is integrally provided with contact terminals making electric connections with...
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creator | UJI KAZUHIRO KUWATA SHUSUKE TAKAMI TOMOKAZU TAKEDA SHUICHI |
description | PROBLEM TO BE SOLVED: To provide a memory card which can be made small-sized and thin and held strong on the whole. SOLUTION: This memory card has a semiconductor memory which can have its recording contents rewritten and is integrally provided with contact terminals making electric connections with equipment and further equipped with a CSP type semiconductor memory 2 composed of a chip-size package, a mount substrate 1 where the contact terminals 8 are formed by printed wiring, and upper and lower housings 6 and 7 which contain the semiconductor memory and a substrate so as to constitute a memory card main body. The semiconductor memory 2 has its terminals 2a, formed on its reverse surface, on the mount substrate 1 by soldering 2b and fillers 9 and 9b are applied between the package flank of the semiconductor memory 2 and the mount substrate 1 to unite them; while the semiconductor memory 2 is mounted, the mount substrate 1 is held by the upper and lower housings 6 and 7. |
format | Patent |
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SOLUTION: This memory card has a semiconductor memory which can have its recording contents rewritten and is integrally provided with contact terminals making electric connections with equipment and further equipped with a CSP type semiconductor memory 2 composed of a chip-size package, a mount substrate 1 where the contact terminals 8 are formed by printed wiring, and upper and lower housings 6 and 7 which contain the semiconductor memory and a substrate so as to constitute a memory card main body. The semiconductor memory 2 has its terminals 2a, formed on its reverse surface, on the mount substrate 1 by soldering 2b and fillers 9 and 9b are applied between the package flank of the semiconductor memory 2 and the mount substrate 1 to unite them; while the semiconductor memory 2 is mounted, the mount substrate 1 is held by the upper and lower housings 6 and 7.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020118&DB=EPODOC&CC=JP&NR=2002015296A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020118&DB=EPODOC&CC=JP&NR=2002015296A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UJI KAZUHIRO</creatorcontrib><creatorcontrib>KUWATA SHUSUKE</creatorcontrib><creatorcontrib>TAKAMI TOMOKAZU</creatorcontrib><creatorcontrib>TAKEDA SHUICHI</creatorcontrib><title>MEMORY CARD</title><description>PROBLEM TO BE SOLVED: To provide a memory card which can be made small-sized and thin and held strong on the whole. 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The semiconductor memory 2 has its terminals 2a, formed on its reverse surface, on the mount substrate 1 by soldering 2b and fillers 9 and 9b are applied between the package flank of the semiconductor memory 2 and the mount substrate 1 to unite them; while the semiconductor memory 2 is mounted, the mount substrate 1 is held by the upper and lower housings 6 and 7.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD2dfX1D4pUcHYMcuFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBkYGhqZGlmaOxkQpAgCi3xxv</recordid><startdate>20020118</startdate><enddate>20020118</enddate><creator>UJI KAZUHIRO</creator><creator>KUWATA SHUSUKE</creator><creator>TAKAMI TOMOKAZU</creator><creator>TAKEDA SHUICHI</creator><scope>EVB</scope></search><sort><creationdate>20020118</creationdate><title>MEMORY CARD</title><author>UJI KAZUHIRO ; KUWATA SHUSUKE ; TAKAMI TOMOKAZU ; TAKEDA SHUICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2002015296A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>UJI KAZUHIRO</creatorcontrib><creatorcontrib>KUWATA SHUSUKE</creatorcontrib><creatorcontrib>TAKAMI TOMOKAZU</creatorcontrib><creatorcontrib>TAKEDA SHUICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UJI KAZUHIRO</au><au>KUWATA SHUSUKE</au><au>TAKAMI TOMOKAZU</au><au>TAKEDA SHUICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MEMORY CARD</title><date>2002-01-18</date><risdate>2002</risdate><abstract>PROBLEM TO BE SOLVED: To provide a memory card which can be made small-sized and thin and held strong on the whole. SOLUTION: This memory card has a semiconductor memory which can have its recording contents rewritten and is integrally provided with contact terminals making electric connections with equipment and further equipped with a CSP type semiconductor memory 2 composed of a chip-size package, a mount substrate 1 where the contact terminals 8 are formed by printed wiring, and upper and lower housings 6 and 7 which contain the semiconductor memory and a substrate so as to constitute a memory card main body. The semiconductor memory 2 has its terminals 2a, formed on its reverse surface, on the mount substrate 1 by soldering 2b and fillers 9 and 9b are applied between the package flank of the semiconductor memory 2 and the mount substrate 1 to unite them; while the semiconductor memory 2 is mounted, the mount substrate 1 is held by the upper and lower housings 6 and 7.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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language | eng |
recordid | cdi_epo_espacenet_JP2002015296A |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES |
title | MEMORY CARD |
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