METHOD AND APPARATUS FOR BARREL PLATING

PROBLEM TO BE SOLVED: To reduce the variance of the plating deposition, and to reduce the number of workers and the installation area of a barrel plating apparatus by intermittently moving barrel units successively from an end in a plating tank, and implementing the plating while the barrel units ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAKURAI TAKASHI, KONNO TADAYOSHI, MORI KANEO, ONODERA AKIRA, KUME HISASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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