CLEAN MOLDINGS AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide clean moldings excellent in tear strength, impact resistance, low-temperature heat sealability, moldability, etc., and suitable for applications requiring clean containers, etc., such as for food, medical equipment, and electronic materials, and to provide a manufact...

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Bibliographische Detailangaben
Hauptverfasser: HIGUCHI REIJI, EGASHIRA TOSHIAKI, ORIGASA YUICHI, KAMIYA TATSUYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide clean moldings excellent in tear strength, impact resistance, low-temperature heat sealability, moldability, etc., and suitable for applications requiring clean containers, etc., such as for food, medical equipment, and electronic materials, and to provide a manufacturing method of the same. SOLUTION: The clean moldings comprise a resin material containing (A) 100-10 wt.% ethylene (co)polymer and (B) 0-90 wt.% other polyethylene resin. Ethylene (co)polymer A has a density of 0.86-0.97 g/cm3, an MFR of 0.01-50 g/10 min, and a mol.wt. distribution of 1.5-4.5 and satisfies the relation represented by the equation: T75-T25