METHOD AND EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can form a plated film of a high quality, smoothly with reduced manufacturing load by reducing load for a concentration control of additive for plating liquid and an agitation without imposing a burden of time control after forming a seeding layer, and to provide the manufacturing equipment. SOLUTION: A treatment agent including a material for accelerating a plated film formation and a material for inhibiting the plated film formation is forced to stick on a surface, and the surface of the substrate on which the treatment agent is stuck is plated. The load for a control of additive concentration of plating liquid and an agitation is reduced because the additive is not used as a solution. In addition, a substrate to be treated on which a seeding layer is formed is introduced to a treating space, and the introduced substrate is reduced. Then, there is not special need to control time after forming a seeding layer, because of the reduction treatment of the seeding layer.