METHOD AND MECHANISM FOR SPUTTERING

PROBLEM TO BE SOLVED: To solve the problem that film thickness increases more than needed and film thickness uniformity between disks in not in a normal rage when number of times that a disk mounted on a rotary body passes over target is increased as a means for adjusting film thickness correspondin...

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Bibliographische Detailangaben
Hauptverfasser: KITAI TAKAHIRO, SUEMITSU TOSHIYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To solve the problem that film thickness increases more than needed and film thickness uniformity between disks in not in a normal rage when number of times that a disk mounted on a rotary body passes over target is increased as a means for adjusting film thickness corresponding to a decrease in filming rate, as to a sputtering device which forms a film on the disk mounted on the rotary body when the disk passes in front of the target plural times. SOLUTION: An integral discharging time and the quantity of a decrease in filming rate which are previously measured and the rotating speed of the rotary body 4 and the value of a decrease in filming rate are inputted to an arithmetic circuit 13 to obtain an integral discharging time when a film is formed on the disk and always monitor it; when the timing where the filming rate of the target 3 begins decrease is detected, the rotating speed of the rotary body 4 is obtained, the rotating speed of a motor 5 which drives the rotary body 4 so that the film thickness becomes constant is computed, and the value is supplied as a new rotating speed command value 9 for the motor 5.