METHOD OF MANUFACTURING MULTILAYER BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board which can minimize the thickness dispersion of a lower insulating layer. SOLUTION: This is a manufacturing method compresses a process of manufacturing a protective film molded item 33 10-5 μm in thickness by repeating the...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MATSUMOTO YUZURU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!