HIGH-PERFORMANCE MULTI-CHIP IC PACKAGE
PROBLEM TO BE SOLVED: To provide a multi-chip IC package with high interconnection density. SOLUTION: The upper surface (or lower surface) of a flexible substrate is joined to a rigid support substrate with an opening for accommodating an IC chip that is joined to the upper surface (or lower surface...
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| creator | TAI KING L DUDDERAR THOMAS D DEGANI YINON |
| description | PROBLEM TO BE SOLVED: To provide a multi-chip IC package with high interconnection density. SOLUTION: The upper surface (or lower surface) of a flexible substrate is joined to a rigid support substrate with an opening for accommodating an IC chip that is joined to the upper surface (or lower surface) of the flexible substrate. In a preferred embodiment, a plurality of IC memories are mounted to one surface of the flexible substrate, and at least one logic chip is mounted to the other surface. An extremely thin flexible substrate is used to optimize the through hole interconnection length between the memory element and the logic element. When the logic chip is to be mounted to a hollow part that is formed by an opening by flip chips, a heat sink plate is used to cover the hollow part and at the same time perform efficient thermal contact to the reverse side of the logic chip. |
| format | Patent |
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SOLUTION: The upper surface (or lower surface) of a flexible substrate is joined to a rigid support substrate with an opening for accommodating an IC chip that is joined to the upper surface (or lower surface) of the flexible substrate. In a preferred embodiment, a plurality of IC memories are mounted to one surface of the flexible substrate, and at least one logic chip is mounted to the other surface. An extremely thin flexible substrate is used to optimize the through hole interconnection length between the memory element and the logic element. 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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | HIGH-PERFORMANCE MULTI-CHIP IC PACKAGE |
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