MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve packaging property and appearance quality by preventing resin from sticking to a surface wherein a lead is packaged in a peripheral-type semiconductor device. SOLUTION: The device consists of a square tabs supporting a semiconductor chip, a plurality of leads 1a arra...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OSAKA SHINGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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