MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To improve packaging property and appearance quality by preventing resin from sticking to a surface wherein a lead is packaged in a peripheral-type semiconductor device. SOLUTION: The device consists of a square tabs supporting a semiconductor chip, a plurality of leads 1a arra...

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1. Verfasser: OSAKA SHINGO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To improve packaging property and appearance quality by preventing resin from sticking to a surface wherein a lead is packaged in a peripheral-type semiconductor device. SOLUTION: The device consists of a square tabs supporting a semiconductor chip, a plurality of leads 1a arranged in the periphery of the tab and extending toward an outside from the periphery of the tabs, a wire connecting a surface electrode of the semiconductor chip and the lead 1a corresponding to it, a sealing part 3 formed by resin sealing of a part of the semiconductor chip and the lead 1a, and a tab suspending lead 1c which suspends the tab and is provided with a through hole 1d in a projection part 1k projecting from the sealing part 3 to an outside. Since remaining resin 9a formed integrally in connection with the sealing part 3 gets into the through hole 1d of the projection part 1k of the tab suspending lead 1c, bonding property between the remaining resin 9a and the projection part 1k of the tab suspending lead 1c is improved, thus preventing the remaining resin 9a from peeling when a lead is cut.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
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