PLATING DEVICE
PROBLEM TO BE SOLVED: To provide a plating device with which increase in the volume of a plating liquid replenished to a plating tank is prevented and the cost of treating the waste plating liquid is reduced. SOLUTION: This plating device is provided with a plating tank 10 storing a plating liquid 1...
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| creator | SONODA HARUKI MORITO TAISHIN TACHIHABA YOSHITO NOBATA HIROYOSHI OTSUBO TETSURO |
| description | PROBLEM TO BE SOLVED: To provide a plating device with which increase in the volume of a plating liquid replenished to a plating tank is prevented and the cost of treating the waste plating liquid is reduced. SOLUTION: This plating device is provided with a plating tank 10 storing a plating liquid 1 and wherein an article to be plated is dipped and electroplated by an anode and a cathode, a control means 16 for controlling the plating of the article, a concentration detecting means 14 driven by the control means 16 and detecting the concentration of a plating component in the plating liquid 1 consumed by the plating in the tank 10, a replenishing means 18 for dissolving and adding a plating material 2 as the plating component directly to the plating liquid 1 in the tank 10 in accordance with the detection result of the means 14 under the control of the means 16 and a circulating means 12 driven by the control means 16, circulating the plating liquid 1 in the tank 10 and mixing the plating material 2 added by the replenishing means 18 and the plating liquid 1. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2001207298A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2001207298A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2001207298A3</originalsourceid><addsrcrecordid>eNrjZOAL8HEM8fRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBoZGBuZGlhaOxkQpAgD3cx1G</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PLATING DEVICE</title><source>esp@cenet</source><creator>SONODA HARUKI ; MORITO TAISHIN ; TACHIHABA YOSHITO ; NOBATA HIROYOSHI ; OTSUBO TETSURO</creator><creatorcontrib>SONODA HARUKI ; MORITO TAISHIN ; TACHIHABA YOSHITO ; NOBATA HIROYOSHI ; OTSUBO TETSURO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a plating device with which increase in the volume of a plating liquid replenished to a plating tank is prevented and the cost of treating the waste plating liquid is reduced. SOLUTION: This plating device is provided with a plating tank 10 storing a plating liquid 1 and wherein an article to be plated is dipped and electroplated by an anode and a cathode, a control means 16 for controlling the plating of the article, a concentration detecting means 14 driven by the control means 16 and detecting the concentration of a plating component in the plating liquid 1 consumed by the plating in the tank 10, a replenishing means 18 for dissolving and adding a plating material 2 as the plating component directly to the plating liquid 1 in the tank 10 in accordance with the detection result of the means 14 under the control of the means 16 and a circulating means 12 driven by the control means 16, circulating the plating liquid 1 in the tank 10 and mixing the plating material 2 added by the replenishing means 18 and the plating liquid 1.</description><edition>7</edition><language>eng</language><subject>APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010731&DB=EPODOC&CC=JP&NR=2001207298A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010731&DB=EPODOC&CC=JP&NR=2001207298A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONODA HARUKI</creatorcontrib><creatorcontrib>MORITO TAISHIN</creatorcontrib><creatorcontrib>TACHIHABA YOSHITO</creatorcontrib><creatorcontrib>NOBATA HIROYOSHI</creatorcontrib><creatorcontrib>OTSUBO TETSURO</creatorcontrib><title>PLATING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a plating device with which increase in the volume of a plating liquid replenished to a plating tank is prevented and the cost of treating the waste plating liquid is reduced. SOLUTION: This plating device is provided with a plating tank 10 storing a plating liquid 1 and wherein an article to be plated is dipped and electroplated by an anode and a cathode, a control means 16 for controlling the plating of the article, a concentration detecting means 14 driven by the control means 16 and detecting the concentration of a plating component in the plating liquid 1 consumed by the plating in the tank 10, a replenishing means 18 for dissolving and adding a plating material 2 as the plating component directly to the plating liquid 1 in the tank 10 in accordance with the detection result of the means 14 under the control of the means 16 and a circulating means 12 driven by the control means 16, circulating the plating liquid 1 in the tank 10 and mixing the plating material 2 added by the replenishing means 18 and the plating liquid 1.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAL8HEM8fRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBoZGBuZGlhaOxkQpAgD3cx1G</recordid><startdate>20010731</startdate><enddate>20010731</enddate><creator>SONODA HARUKI</creator><creator>MORITO TAISHIN</creator><creator>TACHIHABA YOSHITO</creator><creator>NOBATA HIROYOSHI</creator><creator>OTSUBO TETSURO</creator><scope>EVB</scope></search><sort><creationdate>20010731</creationdate><title>PLATING DEVICE</title><author>SONODA HARUKI ; MORITO TAISHIN ; TACHIHABA YOSHITO ; NOBATA HIROYOSHI ; OTSUBO TETSURO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001207298A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>SONODA HARUKI</creatorcontrib><creatorcontrib>MORITO TAISHIN</creatorcontrib><creatorcontrib>TACHIHABA YOSHITO</creatorcontrib><creatorcontrib>NOBATA HIROYOSHI</creatorcontrib><creatorcontrib>OTSUBO TETSURO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONODA HARUKI</au><au>MORITO TAISHIN</au><au>TACHIHABA YOSHITO</au><au>NOBATA HIROYOSHI</au><au>OTSUBO TETSURO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PLATING DEVICE</title><date>2001-07-31</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To provide a plating device with which increase in the volume of a plating liquid replenished to a plating tank is prevented and the cost of treating the waste plating liquid is reduced. SOLUTION: This plating device is provided with a plating tank 10 storing a plating liquid 1 and wherein an article to be plated is dipped and electroplated by an anode and a cathode, a control means 16 for controlling the plating of the article, a concentration detecting means 14 driven by the control means 16 and detecting the concentration of a plating component in the plating liquid 1 consumed by the plating in the tank 10, a replenishing means 18 for dissolving and adding a plating material 2 as the plating component directly to the plating liquid 1 in the tank 10 in accordance with the detection result of the means 14 under the control of the means 16 and a circulating means 12 driven by the control means 16, circulating the plating liquid 1 in the tank 10 and mixing the plating material 2 added by the replenishing means 18 and the plating liquid 1.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | PLATING DEVICE |
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