ELECTROPLATING DEVICE

ELECTROPLATING DEVICE

PROBLEM TO BE SOLVED: To provide an electroplating device which is capable of applying electroplating of a uniform film thickness distribution to an object to be plated which has a conductive ground substrate layer of various deposition states without carrying out laborious work, such as exchange of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SONODA HARUKI, MORITO TAISHIN, TACHIHABA YOSHITO, NOBATA HIROYOSHI, OTSUBO TETSURO
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electroplating device which is capable of applying electroplating of a uniform film thickness distribution to an object to be plated which has a conductive ground substrate layer of various deposition states without carrying out laborious work, such as exchange of ancillary parts of a treating vessel, such as anode electrodes and shielding plates, and changing of their mounting positions. SOLUTION: A main anode 13 and sub-anode 14 are arranged within the plating treating vessel 11. The current control of the main anode 13 and sub- anode 14 is independently executed by a current control section 16 and the changing of the current control conditions to a plurality is made possible.