METHOD AND APPARATUS FOR TESTING PRODUCT WAFER

PROBLEM TO BE SOLVED: To provide an apparatus for burn-in testing chips on a wafer at once. SOLUTION: The apparatus for testing a product/chips on a circular product wafer comprises an O-ring seal provided apart from the wafer so as to surround the wafer, a chuck having a vacuum port provided betwee...

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Bibliographische Detailangaben
Hauptverfasser:	PAUL M GASUKE, PERRY CHARLES H, THOMAS W BACHELDER, MARK R LAFOSSE, DR ROGER R SKUMID, DENISE R CONCH, JAMES M CRAFTS, JOSEPH J VAN HORNE, DENISE R BARINGER, DAVID L GADEL, WAYDE H WHITE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an apparatus for burn-in testing chips on a wafer at once. SOLUTION: The apparatus for testing a product/chips on a circular product wafer comprises an O-ring seal provided apart from the wafer so as to surround the wafer, a chuck having a vacuum port provided between the O-ring seal and the wafer, a first board having a probe contacting the chips on the wafer at one end and a contact at the other end, a second board having a tester chip mounted at one side and a contact connected to the contact of the first board at the other end, a test head having a peripheral part engaged with the O-ring seal, a means for selectively feeding a vacuum pressure to the vacuum port, and means for selectively moving the chuck in a direction parallel or perpendicular to the surface of the test head.