METHOD AND APPARATUS OF MANUFACTURING ELECTRONIC CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To make a nitrogen atmosphere heating furnace and a cleaning appara tus unnecessary in a soldering process of an electronic circuit device, and realize a high precise ball terminal of BGA or the like and correction technique. SOLUTION: On lands 1c of an 1C package 1, solder is...

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Bibliographische Detailangaben
1. Verfasser:	TANIGUCHI YUZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make a nitrogen atmosphere heating furnace and a cleaning appara tus unnecessary in a soldering process of an electronic circuit device, and realize a high precise ball terminal of BGA or the like and correction technique. SOLUTION: On lands 1c of an 1C package 1, solder is stuck and is upper part is covered with liquid 8 whose boiling point is higher than a melting point of the solder. The stuck solder 7 is heated, method and solidified at a temperature lower than or equal to the boiling of the liquid 8, and ball terminals are formed. After that, the liquid 8 is boiled and vaporized in a decompression chamber. In other case, by locally heating the stuck solder 7 parts, solder is heated and cooled not being in contact with oxygen in atmospheric air under a condition that the liquid 8 is not boiled and evaporated. As result, nitrogen atmosphere heating and cleaning are made unnecessary.