MULTILAYER BOARD INCORPORATING ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR

PROBLEM TO BE SOLVED: To further increase the mounting area of electronic device three- dimensionally by contriving a method for making thin a multilayer board and to mount electronic devices at high density. SOLUTION: The multilayer board incorporating electronic devices comprises electronic devices 3A, 3B, boards 1A, 1B mounting the electronic devices 3A, 3B, prepregs 4, 5 laminated on the mounting boards 1A, 1B while sealing the electronic devices 3A, 3B, and an inner layer wiring board 2 laminated on the prepregs 4, 5 while being connected electrically with the mounting boards 1A, 1B. Under state of an inter-board insulating member, the prepregs 4, 5 are provided with containing regions 4A, 5A of substantially the same size as the electronic devices 3A, 3B. Under a state where the electronic devices 3A, 3B are inserted into the containing regions 4A, 5A, the mounting boards 1A, 1B and the wiring circuit board 2 are hot pressed.