WAFER CLEANING LIQUID AND METHOD OF PRODUCTION OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain a wafer cleaning liquid capable of easily cleaning and removing the resin of a polyimide precursor or the like attached to the side of wafer, quickly drying after cleaning and enabling the cleaning of a large-sized wafer having a diameter of >=200 mm, and to provid...

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Bibliographische Detailangaben
1. Verfasser:	MOTOBE TAKEHARU
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a wafer cleaning liquid capable of easily cleaning and removing the resin of a polyimide precursor or the like attached to the side of wafer, quickly drying after cleaning and enabling the cleaning of a large-sized wafer having a diameter of >=200 mm, and to provide a method of producing a semiconductor device using the wafer cleaning liquid. SOLUTION: The wafer cleaning liquid is prepared by compounding two or more solvents including an aprotic polar solvent, and the specific gravity (at 20 deg.C) of the mixed solvent is