MANUFACTURE OF HIGH PRECISION MICRO PARTS UTILIZING ENERGY BEAM
PROBLEM TO BE SOLVED: To provide a manufacture of high-precision micro parts utilizing energy beam. SOLUTION: This method for manufacturing high-precision micro parts comprises the steps of forming a lower photo resist layer, a conductive layer, and an upper photo resist layer on a substrate not var...
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| creator | SHU BINKETSU HAN SEIDO BOKU DENKO YO SHAKUKO |
| description | PROBLEM TO BE SOLVED: To provide a manufacture of high-precision micro parts utilizing energy beam. SOLUTION: This method for manufacturing high-precision micro parts comprises the steps of forming a lower photo resist layer, a conductive layer, and an upper photo resist layer on a substrate not varied by the radiation of light beam, setting an ultraviolet ray mask thereon, performing the radiation of ultraviolet ray, exposure, developing, and etching, manufacturing one mold hole in the photo resist layers, and filling the hole with metal by electro- galvanizing. The method further comprises the steps of removing residual upper photo resist layer and exposed conductive layer and performing the radiation of X-ray, exposure, and etching so as to provide a residual lower photo resist layers having a proper pattern. The residual lower photo resist layers are aligned overlappingly to provide these layers with a proper height, and then the electro-galvanizing is advanced so as to form an electro-galvanizing structure, and the overlapped residual lower photo resist layers are removed so as to provide a micro parts. |
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SOLUTION: This method for manufacturing high-precision micro parts comprises the steps of forming a lower photo resist layer, a conductive layer, and an upper photo resist layer on a substrate not varied by the radiation of light beam, setting an ultraviolet ray mask thereon, performing the radiation of ultraviolet ray, exposure, developing, and etching, manufacturing one mold hole in the photo resist layers, and filling the hole with metal by electro- galvanizing. The method further comprises the steps of removing residual upper photo resist layer and exposed conductive layer and performing the radiation of X-ray, exposure, and etching so as to provide a residual lower photo resist layers having a proper pattern. The residual lower photo resist layers are aligned overlappingly to provide these layers with a proper height, and then the electro-galvanizing is advanced so as to form an electro-galvanizing structure, and the overlapped residual lower photo resist layers are removed so as to provide a micro parts.</description><edition>7</edition><language>eng</language><subject>APPARATUS THEREFOR ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MACHINE TOOLS ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MICROSTRUCTURAL TECHNOLOGY ; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 ; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ; PERFORMING OPERATIONS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; PUNCHING METAL ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM ; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010403&DB=EPODOC&CC=JP&NR=2001088099A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010403&DB=EPODOC&CC=JP&NR=2001088099A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHU BINKETSU</creatorcontrib><creatorcontrib>HAN SEIDO</creatorcontrib><creatorcontrib>BOKU DENKO</creatorcontrib><creatorcontrib>YO SHAKUKO</creatorcontrib><title>MANUFACTURE OF HIGH PRECISION MICRO PARTS UTILIZING ENERGY BEAM</title><description>PROBLEM TO BE SOLVED: To provide a manufacture of high-precision micro parts utilizing energy beam. SOLUTION: This method for manufacturing high-precision micro parts comprises the steps of forming a lower photo resist layer, a conductive layer, and an upper photo resist layer on a substrate not varied by the radiation of light beam, setting an ultraviolet ray mask thereon, performing the radiation of ultraviolet ray, exposure, developing, and etching, manufacturing one mold hole in the photo resist layers, and filling the hole with metal by electro- galvanizing. The method further comprises the steps of removing residual upper photo resist layer and exposed conductive layer and performing the radiation of X-ray, exposure, and etching so as to provide a residual lower photo resist layers having a proper pattern. The residual lower photo resist layers are aligned overlappingly to provide these layers with a proper height, and then the electro-galvanizing is advanced so as to form an electro-galvanizing structure, and the overlapped residual lower photo resist layers are removed so as to provide a micro parts.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MACHINE TOOLS</subject><subject>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</subject><subject>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>PUNCHING METAL</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><subject>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3dfQLdXN0DgkNclXwd1Pw8HT3UAgIcnX2DPb091Pw9XQO8lcIcAwKCVYIDfH08Yzy9HNXcPVzDXKPVHBydfTlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgaGBhYWBpaWjsZEKQIA2Ygq4g</recordid><startdate>20010403</startdate><enddate>20010403</enddate><creator>SHU BINKETSU</creator><creator>HAN SEIDO</creator><creator>BOKU DENKO</creator><creator>YO SHAKUKO</creator><scope>EVB</scope></search><sort><creationdate>20010403</creationdate><title>MANUFACTURE OF HIGH PRECISION MICRO PARTS UTILIZING ENERGY BEAM</title><author>SHU BINKETSU ; HAN SEIDO ; BOKU DENKO ; YO SHAKUKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001088099A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MACHINE TOOLS</topic><topic>MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25</topic><topic>NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>PUNCHING METAL</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><topic>WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL</topic><toplevel>online_resources</toplevel><creatorcontrib>SHU BINKETSU</creatorcontrib><creatorcontrib>HAN SEIDO</creatorcontrib><creatorcontrib>BOKU DENKO</creatorcontrib><creatorcontrib>YO SHAKUKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHU BINKETSU</au><au>HAN SEIDO</au><au>BOKU DENKO</au><au>YO SHAKUKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF HIGH PRECISION MICRO PARTS UTILIZING ENERGY BEAM</title><date>2001-04-03</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To provide a manufacture of high-precision micro parts utilizing energy beam. SOLUTION: This method for manufacturing high-precision micro parts comprises the steps of forming a lower photo resist layer, a conductive layer, and an upper photo resist layer on a substrate not varied by the radiation of light beam, setting an ultraviolet ray mask thereon, performing the radiation of ultraviolet ray, exposure, developing, and etching, manufacturing one mold hole in the photo resist layers, and filling the hole with metal by electro- galvanizing. The method further comprises the steps of removing residual upper photo resist layer and exposed conductive layer and performing the radiation of X-ray, exposure, and etching so as to provide a residual lower photo resist layers having a proper pattern. The residual lower photo resist layers are aligned overlappingly to provide these layers with a proper height, and then the electro-galvanizing is advanced so as to form an electro-galvanizing structure, and the overlapped residual lower photo resist layers are removed so as to provide a micro parts.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MICROSTRUCTURAL TECHNOLOGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PUNCHING METAL SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL |
| title | MANUFACTURE OF HIGH PRECISION MICRO PARTS UTILIZING ENERGY BEAM |
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