SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor package of a structure, where the thermal conductivity of a package is increased and the heat resistance of the package can be reduced and at the same time, the packaging strength of the packaging surface of the package can be increased, and a semicon...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HAMANO TAKAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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