MANUFACTURE OF LEAD FRAME

PROBLEM TO BE SOLVED: To ensure flatness of a flexible board or a circuit board by locally heating the part of a metal frame applied with adhesive and bonding a flexible board to the metal frame thereby retarding thermal deformation of the metal frame and the flexible board. SOLUTION: Using a heat b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIMAZAKI HIRONORI, TAKEYA NORIAKI, YASUDA TOMO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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