SEMI-CONDUCTOR TESTING DEVICE
PROBLEM TO BE SOLVED: To carry out the contact check of a semi-conductor testing device without using any special unit for contact check. SOLUTION: The device 200 for carrying out test is mounted on the IC socket of a burn-in board. A device deriver 100 impresses a voltage to a prescribed pin 221-1...
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creator | TOKAI TATSUO |
description | PROBLEM TO BE SOLVED: To carry out the contact check of a semi-conductor testing device without using any special unit for contact check. SOLUTION: The device 200 for carrying out test is mounted on the IC socket of a burn-in board. A device deriver 100 impresses a voltage to a prescribed pin 221-1 to be contact-checked. When the contact of the burn-in board with the device 200 does not have any problem, a P channel transistor of the input protecting circuit 210 of the device 200 is inversely biased according to the voltage impression, and currents are outputted to a power source line, and a prescribed output voltage is detected at an output terminal 310 on the power source line. Thus, the contact check is carried out by judging whether or not the device 200 is correctly mounted on the burn-in board. |
format | Patent |
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A device deriver 100 impresses a voltage to a prescribed pin 221-1 to be contact-checked. When the contact of the burn-in board with the device 200 does not have any problem, a P channel transistor of the input protecting circuit 210 of the device 200 is inversely biased according to the voltage impression, and currents are outputted to a power source line, and a prescribed output voltage is detected at an output terminal 310 on the power source line. Thus, the contact check is carried out by judging whether or not the device 200 is correctly mounted on the burn-in board.</description><edition>7</edition><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010126&DB=EPODOC&CC=JP&NR=2001021611A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010126&DB=EPODOC&CC=JP&NR=2001021611A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOKAI TATSUO</creatorcontrib><title>SEMI-CONDUCTOR TESTING DEVICE</title><description>PROBLEM TO BE SOLVED: To carry out the contact check of a semi-conductor testing device without using any special unit for contact check. SOLUTION: The device 200 for carrying out test is mounted on the IC socket of a burn-in board. A device deriver 100 impresses a voltage to a prescribed pin 221-1 to be contact-checked. When the contact of the burn-in board with the device 200 does not have any problem, a P channel transistor of the input protecting circuit 210 of the device 200 is inversely biased according to the voltage impression, and currents are outputted to a power source line, and a prescribed output voltage is detected at an output terminal 310 on the power source line. Thus, the contact check is carried out by judging whether or not the device 200 is correctly mounted on the burn-in board.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJANdvX11HX293MJdQ7xD1IIcQ0O8fRzV3BxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBoYGRoZmhoaOxkQpAgDWvyFu</recordid><startdate>20010126</startdate><enddate>20010126</enddate><creator>TOKAI TATSUO</creator><scope>EVB</scope></search><sort><creationdate>20010126</creationdate><title>SEMI-CONDUCTOR TESTING DEVICE</title><author>TOKAI TATSUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001021611A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TOKAI TATSUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOKAI TATSUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SEMI-CONDUCTOR TESTING DEVICE</title><date>2001-01-26</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To carry out the contact check of a semi-conductor testing device without using any special unit for contact check. SOLUTION: The device 200 for carrying out test is mounted on the IC socket of a burn-in board. A device deriver 100 impresses a voltage to a prescribed pin 221-1 to be contact-checked. When the contact of the burn-in board with the device 200 does not have any problem, a P channel transistor of the input protecting circuit 210 of the device 200 is inversely biased according to the voltage impression, and currents are outputted to a power source line, and a prescribed output voltage is detected at an output terminal 310 on the power source line. Thus, the contact check is carried out by judging whether or not the device 200 is correctly mounted on the burn-in board.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
title | SEMI-CONDUCTOR TESTING DEVICE |
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