SEMICONDUCTOR MODULE AND ITS MANUFACTURE

PROBLEM TO BE SOLVED: To realize a semiconductor module by chip-on-chip mounting of high accuracy and reliability at a low cost using solder bumps by a method wherein a mask is provided between the solder bumps so as to prevent a solder bridge from being formed, and the shape of the mask is devised....

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKASE YOSHIHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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