SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME

PROBLEM TO BE SOLVED: To obtain a semiconductor device and its manufacturing method, which are capable of coping with it in that semiconductor elements can be enhanced in density and lessened in pitch lessening their weight and restraining the effects of stresses caused by a thermal expansion differ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANWA MASARU, IIJIMA MASANORI, UENO SEIJI
Format: Patent
Sprache:eng
Schlagworte:
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