BACKING PAD STRUCTURE

PROBLEM TO BE SOLVED: To reduce the number of working processes and to shorten the assembling work time by forming the diameter of a layer of adhesive, etc., for attaching a template to a backing pad larger than the hole of the template and forming a semiconductor wafer, the template, the backing pa...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KIYONO TOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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