SOLDERING METHOD AND BASIC SOLDERING MATERIAL

PROBLEM TO BE SOLVED: To prevent defective joint due to cracking by forming a nickel skin layer on the surface of a basic material principally comprising copper and forming a thin layer of gold, silver, palladium or tin on the surface of the nickel skin layer thereby blocking undue growth of a compo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ANADA TAKAAKI, IMAMURA YOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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