ALIGNMENT METHOD IN REPAIR DEVICE

ALIGNMENT METHOD IN REPAIR DEVICE

PROBLEM TO BE SOLVED: To reduce frequency of alignment and improve efficiency of operation by carrying out alignment to a mark in one fixed position among marks within the range of a shot and obtaining a position of all the chips based on alignment information. SOLUTION: If attention is paid to chip...

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1. Verfasser: SHIRATO OSAMU
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To reduce frequency of alignment and improve efficiency of operation by carrying out alignment to a mark in one fixed position among marks within the range of a shot and obtaining a position of all the chips based on alignment information. SOLUTION: If attention is paid to chips A to H, for example, chips A to D are exposed on a first shot. After a stage whereon a wafer is loaded is subjected to step movement, chips E to H are exposed by a second shot. In the process, if a position of chips B, C, D to a position of a chip A in one shot is decided first, a position of chips F, G, H can be known just by carrying out alignment to a chip E, for example, in the next one shot. A position of each chip is obtained indirectly by carrying out alignment to an alignment mark inside the same shot.
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SOLUTION: If attention is paid to chips A to H, for example, chips A to D are exposed on a first shot. After a stage whereon a wafer is loaded is subjected to step movement, chips E to H are exposed by a second shot. In the process, if a position of chips B, C, D to a position of a chip A in one shot is decided first, a position of chips F, G, H can be known just by carrying out alignment to a chip E, for example, in the next one shot. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ALIGNMENT METHOD IN REPAIR DEVICE
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