METHOD FOR MEASURING FILM THICKNESS OF PRINTED WIRING BOARD AND OBJECT TO BE MEASURED FOR FILM THICKNESS MEASUREMENT

PROBLEM TO BE SOLVED: To measure a film thickness with accuracy by burying a printed wiring board with a transparent film formed on its surface in synthetic resin mixed and colored with pigment, hardening the resin, thereafter polishing the printed wiring board together with the burying resin to exp...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAMAMURA TAKEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS PRINTED CIRCUITS TESTING
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