COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION

COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION

PROBLEM TO BE SOLVED: To protect an integrated circuit by a grid-like piece and a spacial separation by using an upper side mounting face of the grid-like piece to house an optoelectronics component and using a lower side mounting face to house the integrated circuit. SOLUTION: A photo module 13 is...

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1. Verfasser: KRIEGER JOCHEN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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description PROBLEM TO BE SOLVED: To protect an integrated circuit by a grid-like piece and a spacial separation by using an upper side mounting face of the grid-like piece to house an optoelectronics component and using a lower side mounting face to house the integrated circuit. SOLUTION: A photo module 13 is an optoelectronics component for receving an optical data signal which is composed of a grid-like piece 1 provided with connection leg portions 2 having an upper side mounting face 3 and a lower side mounting face 4. An integrated circuit 5 is mounted with an adhesive on the lower side mounting face 4, and a detector 7 of an optoelectronics receiver for receiving optical data signals is mounted with an adhesive on the upper side mounting face 3. Electric terminals of the integrated circuit 5 and of the detector 7 are connected with bonding wires 6 to the connection leg portions 2 assigned to each. Between the detector 7 and the integrated circuit 5, the grid-like piece 1 has two bending points 8, 9 from which the grid-like piece 1 is extended in the opposite directions, which generates a step 10.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2000223723A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2000223723A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2000223723A3</originalsourceid><addsrcrecordid>eNrjZDBx9vcN8Pdz9QtRcPMPUnB2DAqK9PRzV_APDVHwDwjxdHb0UXBxDHFUCAly9Av29QwO9vT342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGBkZGxuZGxo7GRCkCACyrJ_o</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION</title><source>esp@cenet</source><creator>KRIEGER JOCHEN</creator><creatorcontrib>KRIEGER JOCHEN</creatorcontrib><description>PROBLEM TO BE SOLVED: To protect an integrated circuit by a grid-like piece and a spacial separation by using an upper side mounting face of the grid-like piece to house an optoelectronics component and using a lower side mounting face to house the integrated circuit. SOLUTION: A photo module 13 is an optoelectronics component for receving an optical data signal which is composed of a grid-like piece 1 provided with connection leg portions 2 having an upper side mounting face 3 and a lower side mounting face 4. An integrated circuit 5 is mounted with an adhesive on the lower side mounting face 4, and a detector 7 of an optoelectronics receiver for receiving optical data signals is mounted with an adhesive on the upper side mounting face 3. Electric terminals of the integrated circuit 5 and of the detector 7 are connected with bonding wires 6 to the connection leg portions 2 assigned to each. Between the detector 7 and the integrated circuit 5, the grid-like piece 1 has two bending points 8, 9 from which the grid-like piece 1 is extended in the opposite directions, which generates a step 10.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000811&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000223723A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000811&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000223723A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KRIEGER JOCHEN</creatorcontrib><title>COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION</title><description>PROBLEM TO BE SOLVED: To protect an integrated circuit by a grid-like piece and a spacial separation by using an upper side mounting face of the grid-like piece to house an optoelectronics component and using a lower side mounting face to house the integrated circuit. SOLUTION: A photo module 13 is an optoelectronics component for receving an optical data signal which is composed of a grid-like piece 1 provided with connection leg portions 2 having an upper side mounting face 3 and a lower side mounting face 4. An integrated circuit 5 is mounted with an adhesive on the lower side mounting face 4, and a detector 7 of an optoelectronics receiver for receiving optical data signals is mounted with an adhesive on the upper side mounting face 3. Electric terminals of the integrated circuit 5 and of the detector 7 are connected with bonding wires 6 to the connection leg portions 2 assigned to each. Between the detector 7 and the integrated circuit 5, the grid-like piece 1 has two bending points 8, 9 from which the grid-like piece 1 is extended in the opposite directions, which generates a step 10.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx9vcN8Pdz9QtRcPMPUnB2DAqK9PRzV_APDVHwDwjxdHb0UXBxDHFUCAly9Av29QwO9vT342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgYGBkZGxuZGxo7GRCkCACyrJ_o</recordid><startdate>20000811</startdate><enddate>20000811</enddate><creator>KRIEGER JOCHEN</creator><scope>EVB</scope></search><sort><creationdate>20000811</creationdate><title>COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION</title><author>KRIEGER JOCHEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000223723A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KRIEGER JOCHEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KRIEGER JOCHEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION</title><date>2000-08-11</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To protect an integrated circuit by a grid-like piece and a spacial separation by using an upper side mounting face of the grid-like piece to house an optoelectronics component and using a lower side mounting face to house the integrated circuit. SOLUTION: A photo module 13 is an optoelectronics component for receving an optical data signal which is composed of a grid-like piece 1 provided with connection leg portions 2 having an upper side mounting face 3 and a lower side mounting face 4. An integrated circuit 5 is mounted with an adhesive on the lower side mounting face 4, and a detector 7 of an optoelectronics receiver for receiving optical data signals is mounted with an adhesive on the upper side mounting face 3. Electric terminals of the integrated circuit 5 and of the detector 7 are connected with bonding wires 6 to the connection leg portions 2 assigned to each. Between the detector 7 and the integrated circuit 5, the grid-like piece 1 has two bending points 8, 9 from which the grid-like piece 1 is extended in the opposite directions, which generates a step 10.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COMPONENT FOR CARRYING OUT OPTICAL DATA TRANSMISSION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T17%3A44%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KRIEGER%20JOCHEN&rft.date=2000-08-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2000223723A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true