MANUFACTURE OF CERAMIC MINUTE WIRING BOARD

MANUFACTURE OF CERAMIC MINUTE WIRING BOARD

PROBLEM TO BE SOLVED: To manufacture a ceramic substrate comprising a minute wiring simply, efficiently, and at low cost by printing a wiring pattern on a green sheet and then jointing it to the ceramic substrate. SOLUTION: A wiring pattern 2 is printed on a ceramic green sheet 1, and then the ceram...

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Hauptverfasser: KATO TAKASHI, MORI MAMORU, MIYAKOSHI MOTOHARU, FUJIMOTO HISAKAZU, MIZUSHIMA KIYOSHI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator KATO TAKASHI
MORI MAMORU
MIYAKOSHI MOTOHARU
FUJIMOTO HISAKAZU
MIZUSHIMA KIYOSHI
description PROBLEM TO BE SOLVED: To manufacture a ceramic substrate comprising a minute wiring simply, efficiently, and at low cost by printing a wiring pattern on a green sheet and then jointing it to the ceramic substrate. SOLUTION: A wiring pattern 2 is printed on a ceramic green sheet 1, and then the ceramic green sheet 1 comprising the print pattern is placed on a ceramic substrate 3 with its print surface facing a substrate side for tight-fitting, and it is sintered to manufacture a ceramic minute wiring board 5. Here, the ceramic substrate 3 is normally provided with a through hole or via holes 4a and 4b. With this, the circuit on the surface of ceramic substrate is conductive to the circuit 2 formed by printing on the green sheet 1. Since the green sheet is hygroscopic, the solvent content in a past moves to the green sheet just after printing, suppressing fluidity of the paste.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2000124584A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2000124584A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2000124584A3</originalsourceid><addsrcrecordid>eNrjZNDydfQLdXN0DgkNclXwd1Nwdg1y9PV0VvD19AsNcVUI9wzy9HNXcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgYGhkYmphYmjsZEKQIAifgk5w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURE OF CERAMIC MINUTE WIRING BOARD</title><source>esp@cenet</source><creator>KATO TAKASHI ; MORI MAMORU ; MIYAKOSHI MOTOHARU ; FUJIMOTO HISAKAZU ; MIZUSHIMA KIYOSHI</creator><creatorcontrib>KATO TAKASHI ; MORI MAMORU ; MIYAKOSHI MOTOHARU ; FUJIMOTO HISAKAZU ; MIZUSHIMA KIYOSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To manufacture a ceramic substrate comprising a minute wiring simply, efficiently, and at low cost by printing a wiring pattern on a green sheet and then jointing it to the ceramic substrate. SOLUTION: A wiring pattern 2 is printed on a ceramic green sheet 1, and then the ceramic green sheet 1 comprising the print pattern is placed on a ceramic substrate 3 with its print surface facing a substrate side for tight-fitting, and it is sintered to manufacture a ceramic minute wiring board 5. Here, the ceramic substrate 3 is normally provided with a through hole or via holes 4a and 4b. With this, the circuit on the surface of ceramic substrate is conductive to the circuit 2 formed by printing on the green sheet 1. Since the green sheet is hygroscopic, the solvent content in a past moves to the green sheet just after printing, suppressing fluidity of the paste.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000428&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000124584A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000428&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000124584A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KATO TAKASHI</creatorcontrib><creatorcontrib>MORI MAMORU</creatorcontrib><creatorcontrib>MIYAKOSHI MOTOHARU</creatorcontrib><creatorcontrib>FUJIMOTO HISAKAZU</creatorcontrib><creatorcontrib>MIZUSHIMA KIYOSHI</creatorcontrib><title>MANUFACTURE OF CERAMIC MINUTE WIRING BOARD</title><description>PROBLEM TO BE SOLVED: To manufacture a ceramic substrate comprising a minute wiring simply, efficiently, and at low cost by printing a wiring pattern on a green sheet and then jointing it to the ceramic substrate. SOLUTION: A wiring pattern 2 is printed on a ceramic green sheet 1, and then the ceramic green sheet 1 comprising the print pattern is placed on a ceramic substrate 3 with its print surface facing a substrate side for tight-fitting, and it is sintered to manufacture a ceramic minute wiring board 5. Here, the ceramic substrate 3 is normally provided with a through hole or via holes 4a and 4b. With this, the circuit on the surface of ceramic substrate is conductive to the circuit 2 formed by printing on the green sheet 1. Since the green sheet is hygroscopic, the solvent content in a past moves to the green sheet just after printing, suppressing fluidity of the paste.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDydfQLdXN0DgkNclXwd1Nwdg1y9PV0VvD19AsNcVUI9wzy9HNXcPJ3DHLhYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBgYGhkYmphYmjsZEKQIAifgk5w</recordid><startdate>20000428</startdate><enddate>20000428</enddate><creator>KATO TAKASHI</creator><creator>MORI MAMORU</creator><creator>MIYAKOSHI MOTOHARU</creator><creator>FUJIMOTO HISAKAZU</creator><creator>MIZUSHIMA KIYOSHI</creator><scope>EVB</scope></search><sort><creationdate>20000428</creationdate><title>MANUFACTURE OF CERAMIC MINUTE WIRING BOARD</title><author>KATO TAKASHI ; MORI MAMORU ; MIYAKOSHI MOTOHARU ; FUJIMOTO HISAKAZU ; MIZUSHIMA KIYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000124584A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KATO TAKASHI</creatorcontrib><creatorcontrib>MORI MAMORU</creatorcontrib><creatorcontrib>MIYAKOSHI MOTOHARU</creatorcontrib><creatorcontrib>FUJIMOTO HISAKAZU</creatorcontrib><creatorcontrib>MIZUSHIMA KIYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KATO TAKASHI</au><au>MORI MAMORU</au><au>MIYAKOSHI MOTOHARU</au><au>FUJIMOTO HISAKAZU</au><au>MIZUSHIMA KIYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF CERAMIC MINUTE WIRING BOARD</title><date>2000-04-28</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To manufacture a ceramic substrate comprising a minute wiring simply, efficiently, and at low cost by printing a wiring pattern on a green sheet and then jointing it to the ceramic substrate. SOLUTION: A wiring pattern 2 is printed on a ceramic green sheet 1, and then the ceramic green sheet 1 comprising the print pattern is placed on a ceramic substrate 3 with its print surface facing a substrate side for tight-fitting, and it is sintered to manufacture a ceramic minute wiring board 5. Here, the ceramic substrate 3 is normally provided with a through hole or via holes 4a and 4b. With this, the circuit on the surface of ceramic substrate is conductive to the circuit 2 formed by printing on the green sheet 1. Since the green sheet is hygroscopic, the solvent content in a past moves to the green sheet just after printing, suppressing fluidity of the paste.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MANUFACTURE OF CERAMIC MINUTE WIRING BOARD
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T18%3A09%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KATO%20TAKASHI&rft.date=2000-04-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2000124584A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true