LEAD BENDER AND LEAD BENDING METHOD

PROBLEM TO BE SOLVED: To provide a lead bending method which can mold a lead terminal into T shape with less processes, using a lead bender simple of structure and excellent in wide utility, in a lead bending method which bends a plurality of lead terminals planted on the package of a lead relay int...

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Bibliographische Detailangaben

Hauptverfasser:	TAKEI MITSUO, MORII KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES RELAYS SELECTORS SEMICONDUCTOR DEVICES
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