LEAD BENDER AND LEAD BENDING METHOD

LEAD BENDER AND LEAD BENDING METHOD

PROBLEM TO BE SOLVED: To provide a lead bending method which can mold a lead terminal into T shape with less processes, using a lead bender simple of structure and excellent in wide utility, in a lead bending method which bends a plurality of lead terminals planted on the package of a lead relay int...

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Hauptverfasser: TAKEI MITSUO, MORII KENICHI
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
RELAYS
SELECTORS
SEMICONDUCTOR DEVICES
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creator TAKEI MITSUO
MORII KENICHI
description PROBLEM TO BE SOLVED: To provide a lead bending method which can mold a lead terminal into T shape with less processes, using a lead bender simple of structure and excellent in wide utility, in a lead bending method which bends a plurality of lead terminals planted on the package of a lead relay into J shape from the bases. SOLUTION: For a lead bender, the die 51 for bearing a lead terminal 12 has a terminal bearing part 53 to bear the lead terminal 12, and a winding part 54 semicircular in cross section projected from the terminal bearing part 53. Further, the die has a fixed pad 56 and a molding punch 52 where a molding punch 52 to mold the free end side of the lead terminal 12 into circular form is retained slidably by the punch body 55 shifting in the direction crossing the lead terminal 12. The fixed pad 56 shifts in the direction crossing the lead terminal 12 and energizes the lead terminal 12 capable of catch by a spring, and the molding pad 57 shifts in parallel with the lead terminal 12, and it is energized capably of abutment on the winding part 54 by a spring 58.
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SOLUTION: For a lead bender, the die 51 for bearing a lead terminal 12 has a terminal bearing part 53 to bear the lead terminal 12, and a winding part 54 semicircular in cross section projected from the terminal bearing part 53. Further, the die has a fixed pad 56 and a molding punch 52 where a molding punch 52 to mold the free end side of the lead terminal 12 into circular form is retained slidably by the punch body 55 shifting in the direction crossing the lead terminal 12. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
RELAYS
SELECTORS
SEMICONDUCTOR DEVICES
title LEAD BENDER AND LEAD BENDING METHOD
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