METHOD FOR CREATION OF HIGH-FREQUENCY CONNECTION TO HIGH-TEMPERATURE SUPERCONDUCTOR CIRCUIT
PROBLEM TO BE SOLVED: To form an electric connection, in which an oxygen loss inside a high-temperature superconductor(HTS) circuit is made a minimum and which reduces a volume required on the surface of the circuit by a method, wherein a polymer material is treated at as low a temperature as possib...
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| creator | JAMES M MURDOCK GERSHON AKARLING |
| description | PROBLEM TO BE SOLVED: To form an electric connection, in which an oxygen loss inside a high-temperature superconductor(HTS) circuit is made a minimum and which reduces a volume required on the surface of the circuit by a method, wherein a polymer material is treated at as low a temperature as possible. SOLUTION: A first electrical contact 54, a polymer material 42, a diffusion barrier 46, an adhesive layer 58, a coating layer 64 and a solder bump 40 are provided at a first high-temperature superconductor(HTS) circuit 34. A second electrical contact 56, a polymer material 44, a diffusion barrier 48, an adhesive layer 60, a coating layer 62 and a solder bump 38 are provided at a second HTS circuit 36. Then, heat is applied to the first and second solder bumps 38, 40 to make solder reflow. The first and second solder bumps 38, 40 flow, and a single electric connection is formed. When the solder is cooled, the electric connection across the two HTS circuits 34, 36 is solidified. Consequently, the electrical connection to an HTS circuit 20 is obtained, and the degradation of the HTS circuit 20 due to a heating operation and an oxygen loss is made minimum. |
| format | Patent |
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SOLUTION: A first electrical contact 54, a polymer material 42, a diffusion barrier 46, an adhesive layer 58, a coating layer 64 and a solder bump 40 are provided at a first high-temperature superconductor(HTS) circuit 34. A second electrical contact 56, a polymer material 44, a diffusion barrier 48, an adhesive layer 60, a coating layer 62 and a solder bump 38 are provided at a second HTS circuit 36. Then, heat is applied to the first and second solder bumps 38, 40 to make solder reflow. The first and second solder bumps 38, 40 flow, and a single electric connection is formed. When the solder is cooled, the electric connection across the two HTS circuits 34, 36 is solidified. Consequently, the electrical connection to an HTS circuit 20 is obtained, and the degradation of the HTS circuit 20 due to a heating operation and an oxygen loss is made minimum.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000218&DB=EPODOC&CC=JP&NR=2000049394A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000218&DB=EPODOC&CC=JP&NR=2000049394A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JAMES M MURDOCK</creatorcontrib><creatorcontrib>GERSHON AKARLING</creatorcontrib><title>METHOD FOR CREATION OF HIGH-FREQUENCY CONNECTION TO HIGH-TEMPERATURE SUPERCONDUCTOR CIRCUIT</title><description>PROBLEM TO BE SOLVED: To form an electric connection, in which an oxygen loss inside a high-temperature superconductor(HTS) circuit is made a minimum and which reduces a volume required on the surface of the circuit by a method, wherein a polymer material is treated at as low a temperature as possible. SOLUTION: A first electrical contact 54, a polymer material 42, a diffusion barrier 46, an adhesive layer 58, a coating layer 64 and a solder bump 40 are provided at a first high-temperature superconductor(HTS) circuit 34. A second electrical contact 56, a polymer material 44, a diffusion barrier 48, an adhesive layer 60, a coating layer 62 and a solder bump 38 are provided at a second HTS circuit 36. Then, heat is applied to the first and second solder bumps 38, 40 to make solder reflow. The first and second solder bumps 38, 40 flow, and a single electric connection is formed. When the solder is cooled, the electric connection across the two HTS circuits 34, 36 is solidified. Consequently, the electrical connection to an HTS circuit 20 is obtained, and the degradation of the HTS circuit 20 due to a heating operation and an oxygen loss is made minimum.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIj2dQ3x8HdRcPMPUnAOcnUM8fT3U_B3U_DwdPfQdQtyDQx19XOOVHD29_NzdQZLhvhDJENcfQNcgxxDQoNcFYJDgUygGpdQ5xCQQZ5BzqGeITwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMgACEwsjS1NHI2JUgQADIoy5g</recordid><startdate>20000218</startdate><enddate>20000218</enddate><creator>JAMES M MURDOCK</creator><creator>GERSHON AKARLING</creator><scope>EVB</scope></search><sort><creationdate>20000218</creationdate><title>METHOD FOR CREATION OF HIGH-FREQUENCY CONNECTION TO HIGH-TEMPERATURE SUPERCONDUCTOR CIRCUIT</title><author>JAMES M MURDOCK ; GERSHON AKARLING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000049394A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>JAMES M MURDOCK</creatorcontrib><creatorcontrib>GERSHON AKARLING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JAMES M MURDOCK</au><au>GERSHON AKARLING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR CREATION OF HIGH-FREQUENCY CONNECTION TO HIGH-TEMPERATURE SUPERCONDUCTOR CIRCUIT</title><date>2000-02-18</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To form an electric connection, in which an oxygen loss inside a high-temperature superconductor(HTS) circuit is made a minimum and which reduces a volume required on the surface of the circuit by a method, wherein a polymer material is treated at as low a temperature as possible. SOLUTION: A first electrical contact 54, a polymer material 42, a diffusion barrier 46, an adhesive layer 58, a coating layer 64 and a solder bump 40 are provided at a first high-temperature superconductor(HTS) circuit 34. A second electrical contact 56, a polymer material 44, a diffusion barrier 48, an adhesive layer 60, a coating layer 62 and a solder bump 38 are provided at a second HTS circuit 36. Then, heat is applied to the first and second solder bumps 38, 40 to make solder reflow. The first and second solder bumps 38, 40 flow, and a single electric connection is formed. When the solder is cooled, the electric connection across the two HTS circuits 34, 36 is solidified. Consequently, the electrical connection to an HTS circuit 20 is obtained, and the degradation of the HTS circuit 20 due to a heating operation and an oxygen loss is made minimum.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD FOR CREATION OF HIGH-FREQUENCY CONNECTION TO HIGH-TEMPERATURE SUPERCONDUCTOR CIRCUIT |
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