BIDIRECTIONAL OPTICAL TRANSMISSION MODULE
PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 i...
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creator | KAGAMI YUTAKA |
description | PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part. |
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SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES ; TRANSMISSION</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000128&DB=EPODOC&CC=JP&NR=2000031508A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20000128&DB=EPODOC&CC=JP&NR=2000031508A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAGAMI YUTAKA</creatorcontrib><title>BIDIRECTIONAL OPTICAL TRANSMISSION MODULE</title><description>PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. 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SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES TRANSMISSION |
title | BIDIRECTIONAL OPTICAL TRANSMISSION MODULE |
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