BIDIRECTIONAL OPTICAL TRANSMISSION MODULE

PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 i...

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1. Verfasser: KAGAMI YUTAKA
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creator KAGAMI YUTAKA
description PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2000031508A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2000031508A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2000031508A3</originalsourceid><addsrcrecordid>eNrjZNB08nTxDHJ1DvH093P0UfAPCPF0BtIhQY5-wb6ewcFAYQVff5dQH1ceBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkAATGhqYGFo7GRCkCAJBiJP8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>BIDIRECTIONAL OPTICAL TRANSMISSION MODULE</title><source>esp@cenet</source><creator>KAGAMI YUTAKA</creator><creatorcontrib>KAGAMI YUTAKA</creatorcontrib><description>PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES ; TRANSMISSION</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000128&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000031508A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000128&amp;DB=EPODOC&amp;CC=JP&amp;NR=2000031508A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAGAMI YUTAKA</creatorcontrib><title>BIDIRECTIONAL OPTICAL TRANSMISSION MODULE</title><description>PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSMISSION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB08nTxDHJ1DvH093P0UfAPCPF0BtIhQY5-wb6ewcFAYQVff5dQH1ceBta0xJziVF4ozc2g5OYa4uyhm1qQH59aXJCYnJqXWhLvFWBkAATGhqYGFo7GRCkCAJBiJP8</recordid><startdate>20000128</startdate><enddate>20000128</enddate><creator>KAGAMI YUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20000128</creationdate><title>BIDIRECTIONAL OPTICAL TRANSMISSION MODULE</title><author>KAGAMI YUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2000031508A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSMISSION</topic><toplevel>online_resources</toplevel><creatorcontrib>KAGAMI YUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAGAMI YUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BIDIRECTIONAL OPTICAL TRANSMISSION MODULE</title><date>2000-01-28</date><risdate>2000</risdate><abstract>PROBLEM TO BE SOLVED: To enhance workability without imparting a degree of freedom when a light-emitting and light-receiving element is accommodated and unreasonable bending when soldering the light-emitting and light-receiving element, and simplify fixing of the casing. SOLUTION: A lower casing 1 is formed with a synthetic resin, etc., and provided with an accommodating hole 3 of a light-emitting and light-receiving element 2, an optical connector fitting part 4, a hybrid IC substrate 5, a hybrid IC substrate accommodating slit 6, a stopper 7, and an upper casing projection accommodating hole 8. And, the light-emitting and light-receiving element 2 is accommodated in the accommodating hole 3 so that a signal terminal 8 is set to an upper direction. The hybrid IC substrate 5 is slid from rearwardly along the hybrid IC substrate accommodating slit 6 and accommodated therein. Furthermore, it comes into contact with the stopper 7 and is held so that it does not slide to more frontwardly. The light-emitting and light-receiving element 2 is solder-connected to the hybrid IC substrate 5 in a solder part.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION
title BIDIRECTIONAL OPTICAL TRANSMISSION MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T16%3A35%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAGAMI%20YUTAKA&rft.date=2000-01-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2000031508A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true