COPPER-BASE CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To improve oxidation resistance and to improve conductivity by including copper powder or copper powder coated with silver and a thermosetting resin and including at least one kind of substance in an anthranilic ester group. SOLUTION: From a standpoint of conductivity, silver-plated copper powder is used as copper powder preferably. As a thermosetting resin, epoxy resin or the like is available. As to a mixing ratio between the copper powder and the resin, 75-90 wt.% of copper powder is mixed with 25-10 wt.% of resin and a setting agent. As anthranilic ester, methyl anthranilate or the like is available. A desirable ester content is 0.1-10 pts.wt. to 100 pts.wt. of conductive paste. After the surface of copper powder or copper powder coated with silver is treated with anthranilate ester and the like, the copper powder and thermosetting resin are preferably mixed together so as to form conductive paste.