METODO PER TESSERE UNA SUPERFICIE DI SILICIO DI QUALSIASI ORIENTAMENTO OLOGRAFICO DEI CRISTALLI IMPIEGANDO UN ATTACCO CHIMICO ISOTROPICO E UNA FOTOLITOGRAFIA E CRISTALLI DI SILICIO OTTENUTI MEDIANTE TALE METODO

In this process for etching a flat dendritic silicon crystal in order to use it as a photovoltaic cell, a predetermined configuration of etching-resistant material is applied to a surface 111 of the silicon crystal, the configuration covering substantially the entire surface 111, and the surface 111...

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Hauptverfasser: LEONARD EARL HOHN, JEONG MO HWANG, JAMES BERNARD MCNALLY, DANIEL LEO MEIER
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creator LEONARD EARL HOHN
JEONG MO HWANG
JAMES BERNARD MCNALLY
DANIEL LEO MEIER
description In this process for etching a flat dendritic silicon crystal in order to use it as a photovoltaic cell, a predetermined configuration of etching-resistant material is applied to a surface 111 of the silicon crystal, the configuration covering substantially the entire surface 111, and the surface 111 is etched by means of an isotropic etching material until the etching material reveals, by undermining, the configuration of the etching-resistant material substantially completely, thereby forming a set of spikes with sloping sides on the silicon crystal, the isotropic etching material and the configuration cooperating in such a way that the sloping sides have a slope which traps substantially in the interior of the silicon crystal all the light striking the silicon crystal.
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
SEMICONDUCTOR DEVICES
title METODO PER TESSERE UNA SUPERFICIE DI SILICIO DI QUALSIASI ORIENTAMENTO OLOGRAFICO DEI CRISTALLI IMPIEGANDO UN ATTACCO CHIMICO ISOTROPICO E UNA FOTOLITOGRAFIA E CRISTALLI DI SILICIO OTTENUTI MEDIANTE TALE METODO
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